Zili Meng - Bio

Education

• Tsinghua University, Beijing, China                                            2019 – 2024
  Ph.D. Student @ Institute for Network Sciences and Cyberspace
  Advisor: Prof. Mingwei Xu.

• Tsinghua University, Beijing, China                                            2015 – 2019
  B.Eng. @ Electronic Engineering; Minor in Management
  Advisor: Prof. Jun Bi. Outstanding Graduates (2%).

• Northeast Yucai School, Shenyang, China                                 2010 – 2015
  High School Graduate @ Gifted Education Division
  

Work Experiences

• Alibaba, Beijing, China                                                                               Fall 2021
  Research Intern @ XG Lab
  Mentor: Dr. Chen Sun.

• JLSemi, Nanjing, China                                                                              Summer 2021
  SDE Intern @ Network ASIC Team
  Mentor: Mr. Zhaosong Ruan.

• Tencent, Shenzhen, China                                                                         Summer 2020
  Research Intern @ START Cloud Game Team
  Mentor: Mr. Rui Han.

• Massachusetts Institute of Technology, Cambridge, MA, USA         Summer 2018
  Visiting Research Assistant @ Networks and Mobile Systems Group
  Advisor: Prof. Mohammad Alizadeh.

Reviewing Experiences

• Student Editor, Journal of Systems Research (2021 – )

• Conference Program Committee Member

  • PAM 2022.

  • ACM SMS 2021 (co-located with MobiSys 2021)

• Journal Reviewer

  • Elsevier Computer Networks (2019 – 2021)

  • IEEE Transactions on Network and Service Management (2018, 2019)

Other Professional Services

• Artifact Evaluation Committee (AEC) Member, ACM SIGCOMM 2021, USENIX OSDI 2021, EuroSys 2021, USENIX OSDI 2020

• Shadow PC Member, EuroSys 2020, ACM IMC 2018

Selected Honors

For a full list of honors, please refer to my CV.

• Microsoft Research Asia Fellowship (2020)

• ACM SIGCOMM 2018 Student Research Competition Gold Medal (the 1st Place) (video)

• IEEE/ACM IWQoS 2021 Best Paper Award

• IEEE ICC 2020 Best Paper Award

• Tsinghua Top Grade Scholarship (2018)

Professional Memberships

• ACM [S’17]

• IEEE [S’18]